[G-4-3] Copper Electrodeposition of High-Aspect-Ratio Vias for Three Dimensional Packaging

Kazuo Kondo, Toshihiro Yonezawa, Manabu Tomisaka, Hitoshi Yonemura, Masataka Hoshino, Yuichi Taguchi, Kenji Takahashi (1.Department of Applied Chemistry,Okayama University, 2.Tsukuba Research Center, Electronic System Integration Technology Research Department, ASET)

https://doi.org/10.7567/SSDM.2003.G-4-3