Copper Electrodeposition of High-Aspect-Ratio Vias for Three Dimensional Packaging

Kazuo Kondo; Toshihiro Yonezawa; Manabu Tomisaka; Hitoshi Yonemura; Masataka Hoshino; Yuichi Taguchi; Kenji Takahashi

doi:https://doi.org/10.7567/SSDM.2003.G-4-3

2003 International Conference on Solid State Devices and Materials

2003年9月16日〜 2003年9月18日
Keio Plaza Inter-Continental Tokyo (Keio Plaza Hotel), Tokyo, Japan

[G-4-3] Copper Electrodeposition of High-Aspect-Ratio Vias for Three Dimensional Packaging

Kazuo Kondo、Toshihiro Yonezawa、Manabu Tomisaka、Hitoshi Yonemura、Masataka Hoshino、Yuichi Taguchi、Kenji Takahashi (1.Department of Applied Chemistry,Okayama University、2.Tsukuba Research Center, Electronic System Integration Technology Research Department, ASET)

https://doi.org/10.7567/SSDM.2003.G-4-3

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