[G-5-4] New Process of Self-organized Interconnection in Packaging by Conductive Adhesive with Low Melting Point Filler

Kiyokazu Yasuda、Jong-Min Kim、Masahiro Yasuda、Kozo Fujimoto (1.Osaka Univ., Graduate School of Eng., Dept. of Manufacturing Science)

https://doi.org/10.7567/SSDM.2003.G-5-4