Electroless Copper Seed Activated by 1nm ICB-Pd Catalytic Layer for Fine Cu Interconnections

Zenglin Wang; Osamu Yaegashi; Hiroyuki Sakaue; Takayuki Takahagi; Shoso Shingubara

doi:https://doi.org/10.7567/SSDM.2003.P3-4

2003 International Conference on Solid State Devices and Materials

2003年9月16日〜 2003年9月18日
Keio Plaza Inter-Continental Tokyo (Keio Plaza Hotel), Tokyo, Japan

[P3-4] Electroless Copper Seed Activated by 1nm ICB-Pd Catalytic Layer for Fine Cu Interconnections

Zenglin Wang、Osamu Yaegashi、Hiroyuki Sakaue、Takayuki Takahagi、Shoso Shingubara (1.Graduate School of Advanced Science of Matter, Hiroshima University)

https://doi.org/10.7567/SSDM.2003.P3-4

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