Tight-Binding Quantum Chemical Molecular Dynamics Simulation on Chemical Mechanical Polishing Process of Cu Surface

Naoyuki Isoda; Katsumi Sasata; Toshiyuki Yokosuka; Akira Endou; Momoji Kubo; Akira Imamura; Akira Miyamoto

doi:https://doi.org/10.7567/SSDM.2003.P3-9

[P3-9] Tight-Binding Quantum Chemical Molecular Dynamics Simulation on Chemical Mechanical Polishing Process of Cu Surface

Naoyuki Isoda、Katsumi Sasata、Toshiyuki Yokosuka、Akira Endou、Momoji Kubo、Akira Imamura、Akira Miyamoto (1.Department of Applied Chemistry, Graduate School of Engineering, Tohoku University、2.Hiroshima Kokusai Gakuin University、3.New Industry Creation Hatchery Center, Tohoku University)

https://doi.org/10.7567/SSDM.2003.P3-9

2003 International Conference on Solid State Devices and Materials

[P3-9] Tight-Binding Quantum Chemical Molecular Dynamics Simulation on Chemical Mechanical Polishing Process of Cu Surface