[F-3-5] Interfacial Microstructure and Joint Properties of Copper Direct Bond Inserted by the Thin Film of Indium

Katsumi Taniguchi、Tomoaki Goto、Kiyokazu Yasuda、Kozo Fujimoto (1.Fuji Electric Advanced Technology Co., Ltd Production Technology Laboratory、2.Osaka Univ., Graduate School of Eng., Dept. of Manufacturing Science)

https://doi.org/10.7567/SSDM.2004.F-3-5