[C-6-1] Comparison between UV and EB cure method for porous PAr / porous MSX hybrid structure
K. Fujita, H. Miyajima, S. Nakao, T. Sakanaka, R. Nakata, H. Yano, T. Yoda
(1.Process & Manufacturing Engineering Center, Semiconductor Company Toshiba Corporation)
https://doi.org/10.7567/SSDM.2005.C-6-1