[C-6-1] Comparison between UV and EB cure method for porous PAr / porous MSX hybrid structure
K. Fujita、H. Miyajima、S. Nakao、T. Sakanaka、R. Nakata、H. Yano、T. Yoda
(1.Process & Manufacturing Engineering Center, Semiconductor Company Toshiba Corporation)
https://doi.org/10.7567/SSDM.2005.C-6-1