[C-6-3] Comparative Studies of Pore Seal Films for Porous-Silica/Cu lnterconnect

Y Shishida, S. Chikaki, M. Shimoyama, R. Yagi, T. Yoshino, T. Ono, A. Ishikawa, N. Fujii, T. Nakayama, K. Kohmura, H. Tanaka, J. Kawahara, Y. Sonoda, H. Matsuo, S. Hishiya, T. Yamanishi, K. Kinoshita, T. Kikkawa (1.MIRAI, Association of Super-Advanced Electronics Technologies(ASET), 2.MIRAI, Advanced Semiconductor Research Center, National Institute of Advanced Industrial Science and Technology, 3.Research Center for Nanodevices and Systems, Hiroshima University)

https://doi.org/10.7567/SSDM.2005.C-6-3