[C-6-3] Comparative Studies of Pore Seal Films for Porous-Silica/Cu lnterconnect

Y Shishida、S. Chikaki、M. Shimoyama、R. Yagi、T. Yoshino、T. Ono、A. Ishikawa、N. Fujii、T. Nakayama、K. Kohmura、H. Tanaka、J. Kawahara、Y. Sonoda、H. Matsuo、S. Hishiya、T. Yamanishi、K. Kinoshita、T. Kikkawa (1.MIRAI, Association of Super-Advanced Electronics Technologies(ASET)、2.MIRAI, Advanced Semiconductor Research Center, National Institute of Advanced Industrial Science and Technology、3.Research Center for Nanodevices and Systems, Hiroshima University)

https://doi.org/10.7567/SSDM.2005.C-6-3