[C-7-2] Highly Thermal Immune Ni GermanoSilicide with Nitrogen-Doped Ni and Co/TiN Double Capping Layer for Nano-Scale CMOS Applications

Soon-Young Oh、Jang-Gn Yun、Yong-Jin Kim、Won-Jae Lee、Hee-Hwan Ji、Tuya Agchbayar、Ui-Sik Kim、Han-Seob Cha、Sang-Bum Heo、Yoo-Jeong Cho、Kil-Jin Han、Yeong-Cheul Kim、Jin-Suk Wang、Hi-Deok Lee (1.Dept. of Electronics Engineering, Chungnam National University、2.R&D Center, MagnaChip Semiconductor Ltd.、3.Dept. Of Materials Engineering, Korea University of Technology and Education)

https://doi.org/10.7567/SSDM.2005.C-7-2