[C-7-2] Highly Thermal Immune Ni GermanoSilicide with Nitrogen-Doped Ni and Co/TiN Double Capping Layer for Nano-Scale CMOS Applications

Soon-Young Oh, Jang-Gn Yun, Yong-Jin Kim, Won-Jae Lee, Hee-Hwan Ji, Tuya Agchbayar, Ui-Sik Kim, Han-Seob Cha, Sang-Bum Heo, Yoo-Jeong Cho, Kil-Jin Han, Yeong-Cheul Kim, Jin-Suk Wang, Hi-Deok Lee (1.Dept. of Electronics Engineering, Chungnam National University, 2.R&D Center, MagnaChip Semiconductor Ltd., 3.Dept. Of Materials Engineering, Korea University of Technology and Education)

https://doi.org/10.7567/SSDM.2005.C-7-2