[D-2-3] Thinning technology for lithium niobate wafer by surface activated bonding and chemical mechanical polishing

C. C. Wu, R. H. Horng, D. S. Wuu, T. N. Chen, C. J. Ting, H.Y. Tsai, C. P. Chou (1.Department of Materials Engineering, National Chung Hsing University, 2.Institute of Precision Engineering, National Chung Hsing University, 3.Mechanical Industry Research Laboratories, Industrial Technology Research Institute, 4.Department of Mechanical Engineering, National Chiao Tung University)

https://doi.org/10.7567/SSDM.2005.D-2-3