[H-4-1] Feasibility analysis of direct tunneling through medium-κ dielectrics for embedded RAM applications

B. Govoreanu、R. Degraeve、T. Kauerauf、W. Magnus、D. Wellekens、G. Groeseneken、J. Van Houdt (1.IMEC、2.Katholieke Universiteit Leuven, ESAT Dept.)

https://doi.org/10.7567/SSDM.2005.H-4-1