[H-6-2] Intelligent Neural Implant Microsystem Fabricated Using Multi-Chip Bonding Technique

Taiichiro Watanabe, Keita Motonami, Kazuhiro Sakamoto, Jun Deguchi, Risato Kobayashi, Ken Komiya, Keiji Okumura, Takafumi Fukushima, Hiroyuki Kurino, Hajime Mushiake, Mitsumasa Koyanagi (1.Dept. of Bioengineering and Robotics, Tohoku Univ., 2.Research Institute of Electrical Communication, Tohoku Univ., 3.Dept. of Physiology, Tohoku Univ. School of Medicine)

https://doi.org/10.7567/SSDM.2005.H-6-2