Numerical Study of the Self-Interconnection Assembly Method Using Resin Containing Solder Fillers

Koushi Ohta; Kiyokazu Yasuda; Michiya Matsushima; Kozo Fujimoto

doi:https://doi.org/10.7567/SSDM.2005.P2-10

2005 International Conference on Solid State Devices and Materials

Sep 12, 2005 - Sep 15, 2005
International Conference Center Kobe, Kobe, Japan

[P2-10] Numerical Study of the Self-Interconnection Assembly Method Using Resin Containing Solder Fillers

Koushi Ohta, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto (1.Osaka Univ., Dept. of Materials and Manufacturing Science, Graduate School of Eng.)

https://doi.org/10.7567/SSDM.2005.P2-10

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