[P2-10] Numerical Study of the Self-Interconnection Assembly Method Using Resin Containing Solder Fillers

Koushi Ohta、Kiyokazu Yasuda、Michiya Matsushima、Kozo Fujimoto (1.Osaka Univ., Dept. of Materials and Manufacturing Science, Graduate School of Eng.)

https://doi.org/10.7567/SSDM.2005.P2-10