Shear Stress Analyses in Chemical Mechanical Planarization Processing with Cu/porous low-k Structure

Masako Kodera; Yoshihiro Mochizuki; Akira Fukuda; Hirokuni Hiyama; Manabu Tsujimura

doi:https://doi.org/10.7567/SSDM.2006.G-7-3

[G-7-3] Shear Stress Analyses in Chemical Mechanical Planarization Processing with Cu/porous low-k Structure

Masako Kodera、Yoshihiro Mochizuki、Akira Fukuda、Hirokuni Hiyama、Manabu Tsujimura (1.Process and Manufacturing Engineering Center, Toshiba Semiconductor Company、2.Ebara Research Corp.、3.Ebara Corp.)

https://doi.org/10.7567/SSDM.2006.G-7-3

2006 International Conference on Solid State Devices and Materials

[G-7-3] Shear Stress Analyses in Chemical Mechanical Planarization Processing with Cu/porous low-k Structure