[G-8-2] Defects in Electroplated Cu and their Impact on Stress Migration Reliability

A. Uedono、T. Suzuki、T. Nakamura、T. Ohdaira、R. Suzuki (1.Institute of Applied Physics, University of Tsukuba、2.Semiconductor Technology Academic Research Center (STARC)、3.National Institute of Advanced Industrial Science and Technology (AIST))

https://doi.org/10.7567/SSDM.2006.G-8-2