Defects in Electroplated Cu and their Impact on Stress Migration Reliability

A. Uedono; T. Suzuki; T. Nakamura; T. Ohdaira; R. Suzuki

doi:https://doi.org/10.7567/SSDM.2006.G-8-2

[G-8-2] Defects in Electroplated Cu and their Impact on Stress Migration Reliability

A. Uedono, T. Suzuki, T. Nakamura, T. Ohdaira, R. Suzuki (1.Institute of Applied Physics, University of Tsukuba, 2.Semiconductor Technology Academic Research Center (STARC), 3.National Institute of Advanced Industrial Science and Technology (AIST))

https://doi.org/10.7567/SSDM.2006.G-8-2

2006 International Conference on Solid State Devices and Materials

[G-8-2] Defects in Electroplated Cu and their Impact on Stress Migration Reliability