The Japan Society of Applied Physics

[G-9-2] Diffusion Barrier Property of an Interface Layer Formed with Cu-Mn, Al and Mg Alloy Films on SiO2

J. Iijima, M. Haneda, J. Koike (1.Dept. of Materials Science, Tohoku University, 2.Japan Science and Technology Agency)

https://doi.org/10.7567/SSDM.2006.G-9-2