[P-2-16] A Low Temperature Process of Bonding Fine Pitch Au/Sn Bumps in Air

Ying-Hui Wang, Kenji Nishida, Matthias Hutter, Takashi Kimura, Tadatomo Suga (1.The Univ. of Tokyo, Dept. of Precision Eng. School of Eng., 2.Materials Analysis Station, National Institute for Materials Science, 3.Fraunhofer IZM)

https://doi.org/10.7567/SSDM.2006.P-2-16