[P-2-16] A Low Temperature Process of Bonding Fine Pitch Au/Sn Bumps in Air

Ying-Hui Wang、Kenji Nishida、Matthias Hutter、Takashi Kimura、Tadatomo Suga (1.The Univ. of Tokyo, Dept. of Precision Eng. School of Eng.、2.Materials Analysis Station, National Institute for Materials Science、3.Fraunhofer IZM)

https://doi.org/10.7567/SSDM.2006.P-2-16