Characterization of Line-edge Roughness in Cu/low-k Interconnect Pattern

Atsuko Yamaguchi; Daisuke Ryuzaki; Ken’ichi Takeda; Jiro Yamamoto; Hiroki Kawada; Takashi Iizumi

doi:https://doi.org/10.7567/SSDM.2007.C-10-1

2007 International Conference on Solid State Devices and Materials

Sep 18, 2007 - Sep 21, 2007
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[C-10-1] Characterization of Line-edge Roughness in Cu/low-k Interconnect Pattern

Atsuko Yamaguchi, Daisuke Ryuzaki, Ken’ichi Takeda, Jiro Yamamoto, Hiroki Kawada, Takashi Iizumi (1.Central Research Laboratory, Hitachi Ltd., 2.Hitachi High-Technologies Corp.)

https://doi.org/10.7567/SSDM.2007.C-10-1

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