Characterization of Line-edge Roughness in Cu/low-k Interconnect Pattern

Atsuko Yamaguchi; Daisuke Ryuzaki; Ken’ichi Takeda; Jiro Yamamoto; Hiroki Kawada; Takashi Iizumi

doi:https://doi.org/10.7567/SSDM.2007.C-10-1

2007 International Conference on Solid State Devices and Materials

2007年9月18日〜 2007年9月21日
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[C-10-1] Characterization of Line-edge Roughness in Cu/low-k Interconnect Pattern

Atsuko Yamaguchi、Daisuke Ryuzaki、Ken’ichi Takeda、Jiro Yamamoto、Hiroki Kawada、Takashi Iizumi (1.Central Research Laboratory, Hitachi Ltd.、2.Hitachi High-Technologies Corp.)

https://doi.org/10.7567/SSDM.2007.C-10-1

▲