Influences of Skeletal Structure and Porosity on Dielectric and Mechanical Properties of Porous Organosilica Low-k Films

Syozo Takada; Nobuhiro Hata; Yutaka Seino; Takenobu Yoshino

doi:https://doi.org/10.7567/SSDM.2007.C-9-2

2007 International Conference on Solid State Devices and Materials

Sep 18, 2007 - Sep 21, 2007
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[C-9-2] Influences of Skeletal Structure and Porosity on Dielectric and Mechanical Properties of Porous Organosilica Low-k Films

Syozo Takada, Nobuhiro Hata, Yutaka Seino, Takenobu Yoshino (1.Advanced Semiconductor Research Center, National Institute of Advanced Industrial Science and Technology (AIST))

https://doi.org/10.7567/SSDM.2007.C-9-2

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