[D-2-5] Ferrite and copper electroless plating to photopolymerized resin for micro molding of three-dimensional structures

Shinya Kitayama, Toshiya Yoshimura, Shoji Maruo, Kohki Mukai (1.Department of Mechanical Engineering and Materials Science, Yokohama National University)

https://doi.org/10.7567/SSDM.2007.D-2-5