Ferrite and copper electroless plating to photopolymerized resin for micro molding of three-dimensional structures

Shinya Kitayama; Toshiya Yoshimura; Shoji Maruo; Kohki Mukai

doi:https://doi.org/10.7567/SSDM.2007.D-2-5

2007 International Conference on Solid State Devices and Materials

2007年9月18日〜 2007年9月21日
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[D-2-5] Ferrite and copper electroless plating to photopolymerized resin for micro molding of three-dimensional structures

Shinya Kitayama、Toshiya Yoshimura、Shoji Maruo、Kohki Mukai (1.Department of Mechanical Engineering and Materials Science, Yokohama National University)

https://doi.org/10.7567/SSDM.2007.D-2-5

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