[D-3-4] Thick Au High-Q Inductor and Its Chip-on-Chip Bonding on an RF IC for Various Frequencies

Junichi Kodate, Kei Kuwabara, Norio Sato, Hiroki Morimura, Kazuhisa Kudou, Katsuyuki Machida, Hiromu Ishii (1.NTT Microsystem Integration Laboratories, NTT Corporation, 2.NTT Advanced Technology Corporation)

https://doi.org/10.7567/SSDM.2007.D-3-4