[D-3-4] Thick Au High-Q Inductor and Its Chip-on-Chip Bonding on an RF IC for Various Frequencies

Junichi Kodate、Kei Kuwabara、Norio Sato、Hiroki Morimura、Kazuhisa Kudou、Katsuyuki Machida、Hiromu Ishii (1.NTT Microsystem Integration Laboratories, NTT Corporation、2.NTT Advanced Technology Corporation)

https://doi.org/10.7567/SSDM.2007.D-3-4