The Aluminum Packaging for LED using Selectively Anodizing Method

K.M. Kim; S.H. Shin; Y.K. Lee; S.M. Choi; Y.S. Kwon

doi:https://doi.org/10.7567/SSDM.2007.E-9-5

2007 International Conference on Solid State Devices and Materials

Sep 18, 2007 - Sep 21, 2007
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[E-9-5] The Aluminum Packaging for LED using Selectively Anodizing Method

K.M. Kim, S.H. Shin, Y.K. Lee, S.M. Choi, Y.S. Kwon (1.Department of electrical Engineering and Computer Science, Korea Advanced Institute of Science and Technology (KAIST), 2.Samsung Electro-Mechanics)

https://doi.org/10.7567/SSDM.2007.E-9-5

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