[J-8-3] Manufacturable High-Density 8Mb 1T-1C FRAM Embedded Within a Low-Power 130nm Logic Process

K. R. Udayakumar、T. S. Moise、S. R. Summerfelt、K. Boku、J. Rodriguez、K. Remack、J. Gertas、M. Arendt、G. Shinn、J. Eliason、R. Bailey、P. Staubs (1.Texas Instruments Inc.、2.Ramtron International Corporation)

https://doi.org/10.7567/SSDM.2007.J-8-3