Manufacturable High-Density 8Mb 1T-1C FRAM Embedded Within a Low-Power 130nm Logic Process

K. R. Udayakumar; T. S. Moise; S. R. Summerfelt; K. Boku; J. Rodriguez; K. Remack; J. Gertas; M. Arendt; G. Shinn; J. Eliason; R. Bailey; P. Staubs

doi:https://doi.org/10.7567/SSDM.2007.J-8-3

2007 International Conference on Solid State Devices and Materials

Sep 18, 2007 - Sep 21, 2007
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[J-8-3] Manufacturable High-Density 8Mb 1T-1C FRAM Embedded Within a Low-Power 130nm Logic Process

K. R. Udayakumar, T. S. Moise, S. R. Summerfelt, K. Boku, J. Rodriguez, K. Remack, J. Gertas, M. Arendt, G. Shinn, J. Eliason, R. Bailey, P. Staubs (1.Texas Instruments Inc., 2.Ramtron International Corporation)

https://doi.org/10.7567/SSDM.2007.J-8-3

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