The Japan Society of Applied Physics

[J-8-3] Manufacturable High-Density 8Mb 1T-1C FRAM Embedded Within a Low-Power 130nm Logic Process

K. R. Udayakumar, T. S. Moise, S. R. Summerfelt, K. Boku, J. Rodriguez, K. Remack, J. Gertas, M. Arendt, G. Shinn, J. Eliason, R. Bailey, P. Staubs (1.Texas Instruments Inc., 2.Ramtron International Corporation)

https://doi.org/10.7567/SSDM.2007.J-8-3