[P-2-12] Transmission property of flip chip package with adhesive interconnection for high frequency applications

Jong-Woong Kim、Jae-Hoon Ko、Wansoo Nah、Seung-Boo Jung (1.School of Advanced Materials Science & Engineering, Sungkyunkwan University、2.School of Electrical and Computer Engineering, Sungkyunkwan University)

https://doi.org/10.7567/SSDM.2007.P-2-12