SAW Bumpless Bonding at Low Temperature in Ambient Air

Ying-Hui Wang; Takahiro Sato; Tsuyoshi Sugiura; Tadatomo Suga

doi:https://doi.org/10.7567/SSDM.2007.P-2-13

2007 International Conference on Solid State Devices and Materials

2007年9月18日〜 2007年9月21日
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[P-2-13] SAW Bumpless Bonding at Low Temperature in Ambient Air

Ying-Hui Wang、Takahiro Sato、Tsuyoshi Sugiura、Tadatomo Suga (1.Univ. of Tokyo, Dept. of Precision Eng. School of Eng.、2.Wireless Communication Laboratory, Samsung Yokohama Research Institute)

https://doi.org/10.7567/SSDM.2007.P-2-13

▲