SAW Bumpless Bonding at Low Temperature in Ambient Air

Ying-Hui Wang; Takahiro Sato; Tsuyoshi Sugiura; Tadatomo Suga

doi:https://doi.org/10.7567/SSDM.2007.P-2-13

2007 International Conference on Solid State Devices and Materials

Sep 18, 2007 - Sep 21, 2007
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[P-2-13] SAW Bumpless Bonding at Low Temperature in Ambient Air

Ying-Hui Wang, Takahiro Sato, Tsuyoshi Sugiura, Tadatomo Suga (1.Univ. of Tokyo, Dept. of Precision Eng. School of Eng., 2.Wireless Communication Laboratory, Samsung Yokohama Research Institute)

https://doi.org/10.7567/SSDM.2007.P-2-13

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