[P-2-2] The Evaluation of New Amorphous Hydrocarbon Film aCHx, for Copper Barrier Dielectric Film in Low-k Copper Metallization

Hiraku Ishikawa、Toshihisa Nozawa、Takaaki Matsuoka、Akinobu Teramoto、Masaki Hirayama、Takashi Ito、Tadahiro Ohmi (1.TOKYO ELECTRON LTD.、2.New Industry Creation Hatchery Center, Tohoku University、3.Graduate School of Engineering, Tohoku University)

https://doi.org/10.7567/SSDM.2007.P-2-2