[P-2-2] The Evaluation of New Amorphous Hydrocarbon Film aCHx, for Copper Barrier Dielectric Film in Low-k Copper Metallization

Hiraku Ishikawa, Toshihisa Nozawa, Takaaki Matsuoka, Akinobu Teramoto, Masaki Hirayama, Takashi Ito, Tadahiro Ohmi (1.TOKYO ELECTRON LTD., 2.New Industry Creation Hatchery Center, Tohoku University, 3.Graduate School of Engineering, Tohoku University)

https://doi.org/10.7567/SSDM.2007.P-2-2