[H-7-3] Through Silicon Photonic Via with Si core for Low loss and High Density Vertical Optical Interconnection in 3D-LSI

A. Noriki¹、K. W. Lee¹、J. Bea¹、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2010.H-7-3