[P-1-17] A Novel Hot DI Water Rinse on SOD Filled Self-Aligned Shallow Trench Isolation for Highly Reliable NAND Flash Memory

C. H. Liu¹、Y. M. Lin¹、R. T. Peng¹、H. C. Wei¹、H. J. Chien¹、Y. T. Chiu¹、L. T. Kuo¹、H. P. Hwang¹、M. S. Lee¹、S. Pittikoun¹ (1.Powerchip Semiconductor Corp. , Taiwan)

https://doi.org/10.7567/SSDM.2010.P-1-17