A Novel Hot DI Water Rinse on SOD Filled Self-Aligned Shallow Trench Isolation for Highly Reliable NAND Flash Memory

C. H. Liu; Y. M. Lin; R. T. Peng; H. C. Wei; H. J. Chien; Y. T. Chiu; L. T. Kuo; H. P. Hwang; M. S. Lee; S. Pittikoun

doi:https://doi.org/10.7567/SSDM.2010.P-1-17

[P-1-17] A Novel Hot DI Water Rinse on SOD Filled Self-Aligned Shallow Trench Isolation for Highly Reliable NAND Flash Memory

C. H. Liu¹, Y. M. Lin¹, R. T. Peng¹, H. C. Wei¹, H. J. Chien¹, Y. T. Chiu¹, L. T. Kuo¹, H. P. Hwang¹, M. S. Lee¹, S. Pittikoun¹ (1.Powerchip Semiconductor Corp. , Taiwan)

https://doi.org/10.7567/SSDM.2010.P-1-17

2010 International Conference on Solid State Devices and Materials

[P-1-17] A Novel Hot DI Water Rinse on SOD Filled Self-Aligned Shallow Trench Isolation for Highly Reliable NAND Flash Memory