[P-2-2] RF Modeling of Through Silicon Vias (TSVs) in 3D IC

C. W. Luo¹, Y. C. Wu¹, J. Y. Wang¹, S. S. H. Hsu¹ (1.National Tsing Hua Univ. , Taiwan)

https://doi.org/10.7567/SSDM.2010.P-2-2