Modeling and Co-Design of Novel Packaging Interposer with IPD Layers

S. M. Wu; T. Y. Wu; B. H. Yu; C. C. Wang

doi:https://doi.org/10.7567/SSDM.2010.P-2-5

2010 International Conference on Solid State Devices and Materials

2010年9月21日〜 2010年9月24日
The University of Tokyo, Tokyo, Japan

[P-2-5] Modeling and Co-Design of Novel Packaging Interposer with IPD Layers

S. M. Wu¹、T. Y. Wu¹、B. H. Yu¹、C. C. Wang² (1.National Univ. of Kaohsiung、2.Electrical Lab., Corp. Design Division, Corporate R&D, Advanced Semiconductor Engineering (ASE) Inc., Kaohsiung , Taiwan)

https://doi.org/10.7567/SSDM.2010.P-2-5

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