Impacts of Microbump-Induced Local Bending Stress in 3D-LSI

H. Kino; M. Murugesan; K. W. Lee; J. C. Bea; C. Miyazaki; H. Kobayashi; H. Shimamoto; T. Fukushima; T. Tanaka; M. Koyanagi

doi:https://doi.org/10.7567/SSDM.2011.C-5-2

2011 International Conference on Solid State Devices and Materials

Sep 27, 2011 - Sep 30, 2011
Aichi Industry & Labor Center (WINC AICHI), Nagoya, Japan

[C-5-2] Impacts of Microbump-Induced Local Bending Stress in 3D-LSI

H. Kino¹, M. Murugesan¹, K. W. Lee¹, J. C. Bea¹, C. Miyazaki², H. Kobayashi², H. Shimamoto², T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ., 2.ASET , Japan)

https://doi.org/10.7567/SSDM.2011.C-5-2

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