Impacts of Microbump-Induced Local Bending Stress in 3D-LSI

H. Kino; M. Murugesan; K. W. Lee; J. C. Bea; C. Miyazaki; H. Kobayashi; H. Shimamoto; T. Fukushima; T. Tanaka; M. Koyanagi

doi:https://doi.org/10.7567/SSDM.2011.C-5-2

2011 International Conference on Solid State Devices and Materials

2011年9月27日〜 2011年9月30日
Aichi Industry & Labor Center (WINC AICHI), Nagoya, Japan

[C-5-2] Impacts of Microbump-Induced Local Bending Stress in 3D-LSI

H. Kino¹、M. Murugesan¹、K. W. Lee¹、J. C. Bea¹、C. Miyazaki²、H. Kobayashi²、H. Shimamoto²、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ.、2.ASET , Japan)

https://doi.org/10.7567/SSDM.2011.C-5-2

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