[C-5-3] Room-Temperature Bonding of LSI Chips on PEN Film Using Mechanical Caulking of Au Cone Bump

T. Shuto¹、N. Watanabe¹、A. Ikeda¹、T. Asano¹ (1.Kyushu Univ. , Japan)

https://doi.org/10.7567/SSDM.2011.C-5-3