The Japan Society of Applied Physics

2011 International Conference on Solid State Devices and Materials

2011 International Conference on Solid State Devices and Materials

Sep 27, 2011 - Sep 30, 2011
Aichi Industry & Labor Center (WINC AICHI), Nagoya, Japan

[C-5-4] 3D Chip Stacking of RF Devices with Cu TSV, Cu/Sn Bumps and Sealing Ring

W. Zhang1, B. Majeed1, X. Sun1, G. Posada1, C. Diekmann2, C. Eggs2, E. Schmidhammer2, W. De Raedt1 (1.IMEC , Belgium, 2.EPCOS AG , Germany)

https://doi.org/10.7567/SSDM.2011.C-5-4