[C-5-4] 3D Chip Stacking of RF Devices with Cu TSV, Cu/Sn Bumps and Sealing Ring

W. Zhang¹、B. Majeed¹、X. Sun¹、G. Posada¹、C. Diekmann²、C. Eggs²、E. Schmidhammer²、W. De Raedt¹ (1.IMEC , Belgium、2.EPCOS AG , Germany)

https://doi.org/10.7567/SSDM.2011.C-5-4