Stress from Tungsten-Filled TSVs Measured by Raman Spectroscopy on Cross-Sectional Samples

2011 International Conference on Solid State Devices and Materials

Sep 27, 2011 - Sep 30, 2011
Aichi Industry & Labor Center (WINC AICHI), Nagoya, Japan

J. Gambino¹, D. Vanslette¹, B. Webb¹, C. Luce¹, G. Chrisman¹, T. Ueda², T. Ishigaki², K. Kang², W. S. Yoo² (1.IBM, 2.WaferMasters, Inc. , USA)