Evaluation of Thermo-Mechanical Stress Induced by W-TSVs in 3D-LSI with W/Cu Hybrid TSVs

H. Hashiguchi; M. Murugesan; J. C. Bea; K. W. Lee; T. Fukushima; H. Kobayashi; T. Tanaka; M. Koyanagi

doi:https://doi.org/10.7567/SSDM.2011.C-8-3

2011 International Conference on Solid State Devices and Materials

2011年9月27日〜 2011年9月30日
Aichi Industry & Labor Center (WINC AICHI), Nagoya, Japan

[C-8-3] Evaluation of Thermo-Mechanical Stress Induced by W-TSVs in 3D-LSI with W/Cu Hybrid TSVs

H. Hashiguchi¹、M. Murugesan¹、J. C. Bea¹、K. W. Lee¹、T. Fukushima¹、H. Kobayashi²、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ.、2.Association of Super-Advanced Electronics Tech. , Japan)

https://doi.org/10.7567/SSDM.2011.C-8-3

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