Evaluation of Thermo-Mechanical Stress Induced by W-TSVs in 3D-LSI with W/Cu Hybrid TSVs

H. Hashiguchi; M. Murugesan; J. C. Bea; K. W. Lee; T. Fukushima; H. Kobayashi; T. Tanaka; M. Koyanagi

doi:https://doi.org/10.7567/SSDM.2011.C-8-3

2011 International Conference on Solid State Devices and Materials

Sep 27, 2011 - Sep 30, 2011
Aichi Industry & Labor Center (WINC AICHI), Nagoya, Japan

[C-8-3] Evaluation of Thermo-Mechanical Stress Induced by W-TSVs in 3D-LSI with W/Cu Hybrid TSVs

H. Hashiguchi¹, M. Murugesan¹, J. C. Bea¹, K. W. Lee¹, T. Fukushima¹, H. Kobayashi², T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ., 2.Association of Super-Advanced Electronics Tech. , Japan)

https://doi.org/10.7567/SSDM.2011.C-8-3

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